Active Mold Packaging (AMP)

To functionalize the real-estate of the epoxy mold compound.

Active Mold Packaging is an easy, time-saving and reliable 2.5D packaging approach, which establishes electrical circuitry on the surface and in the volume of the Epoxy Mold Compound.

Epoxy mold compounds (EMC) for semiconductors can do more for you

You can learn more about the advantages of 3D integrated circuits here:

Reduced package cost

Improved thermal management

Reduced package footprint

Increased package lifetime

Molding of Epoxy Mold Compounds

  • Epoxy Mold Compounds, modified for the Laser Direct Structuring (LDS) Technology

Laser Direct Structuring with LPKF Laser Tools

  • Line/ Space of 25 um each

Direct Copper plating

  • Laser Direct Structuring Technology

More solutions for the semiconductor industry

Glass for Heterogeneous Integration -- a team of dedicated engineers and researchers allows you to take advantage of the latest process technology for thin glass applications while focusing on added value for your application.


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