The Active Mold Packaging (AMP) technology

Electrically functionalizing the real-estate of the Epoxy Mold Compound.

AMP converts the passive Epoxy Mold Compound (EMC) only used for protection today, into an active carrier of electrical functionality.

AMP establishes horizontal and vertical interconnect access between active and passive components in a heterogenous 2.5D packaging approach.

AMP is based on 3 proven and standardized electronics manufacturing technologies.

Molding of thermo-set epoxy mold compounds.

Laser Direct Structuring.

Electroless plating.

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