LPKF’s Active Mold Packaging (AMP) technology enables electrical circuits directly on the surface and inside the volume of the epoxy mold compound. This contributes to cost and space savings in advanced packaging manufacturing, and to a higher functional density of finished ICs.
Convert the Epoxy Mold Compound into an active carrier of functionality
Why Active Mold Packaging?
Applications of Active Mold Packaging Technology
LPKF AMP 3000
The system to simplify your back-end manufacturing processes