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AMP-Technology
AMP offers additional metal planes in the EMC in three simple steps. Molding, Lasering and Plating. AMP offers additional metal planes in the EMC in three simple steps. Molding, Lasering and Plating.

Electrically functionalize the EMC of your IC Package with

ACTIVE MOLD PACKAGING
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LPKF AMP 3000 - Solutions for back-end manufacturing

LPKF AMP 3000

Solutions for
back-end manufacturing
Learn more

Active Mold Packaging Technologie (AMP)

Value adding solution for advanced IC packages

Convert the Epoxy Mold Compound into an active carrier of functionality

You can learn more about the AMP Technology, its many advantages and applications by clicking on the following pages:

Technology

Active Mold Packaging

 
Applications

Application

 
The System

The System

 

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