AMP-Technology
AMP offers additional metal planes in the EMC in three simple steps. Molding, Lasering and Plating.

Electrically functionalize the EMC of your IC Package with

ACTIVE MOLD PACKAGING
LPKF AMP 3000 - Solutions for back-end manufacturing

LPKF AMP 3000

Solutions for
back-end manufacturing

Active Mold Packaging Technologie (AMP)

Value adding solution for advanced IC packages

LPKF’s Active Mold Packaging (AMP) technology enables electrical circuits directly on the surface and inside the volume of the epoxy mold compound. This contributes to cost and space savings in advanced packaging manufacturing, and to a higher functional density of finished ICs.

Convert the Epoxy Mold Compound into an active carrier of functionality

Technology

Why Active Mold Packaging?

Applications

Applications of Active Mold Packaging Technology

LPKF AMP 3000

The system to simplify your back-end manufacturing processes