Epoxy mold compounds (EMC) for semiconductors can do more for you
You can learn more about the advantages of 3D integrated circuits here:
Reduced package cost
Improved thermal management
Reduced package footprint
Increased package lifetime
Molding of Epoxy Mold Compounds
Epoxy Mold Compounds, modified for the Laser Direct Structuring (LDS) Technology
Laser Direct Structuring with LPKF Laser Tools
- Line/ Space of 25 um each
Direct Copper plating
- Laser Direct Structuring Technology
More solutions for the semiconductor industry
Glass for Heterogeneous Integration -- a team of dedicated engineers and researchers allows you to take advantage of the latest process technology for thin glass applications while focusing on added value for your application.