Epoxy mold compounds (EMC) for semiconductors can do more for you
You can learn more about the advantages of 3D integrated circuits here:
Reduced package cost
Up to 30% cost reduction for Package-on-Package
compared to traditional sequential layer build up technology
Improved thermal management
Up to 10x higher heat dissipation of mold-embedded copper heat sink compared to thermally conductive Epoxy Mold Compounds
Reduced package footprint
Up to 50% more vias
compared to traditional TMV drilling and copper paste printing
Increased package lifetime
Capable of up to 50% more shear load, therefore greater solder joint reliability
compared to of traditional wire bonding.
Molding of Epoxy Mold Compounds
Epoxy Mold Compounds, modified for the Laser Direct Structuring (LDS) Technology
EMC available in liquid, granular and tablet form from a variety of compound suppliers
for Leadframe, Substrate and Wafer level applications
All standard and existing EMC compounds can be upgraded for use in Active Mold Packaging
Laser Direct Structuring with LPKF Laser Tools
- Line/ Space of 25 um each
- via aspect ratio of up to 1:10
- laser patterning and via laser drilling in one process step
- fully automed production
- visual inspection station
Direct Copper plating
- Laser Direct Structuring Technology enables direct electroless plating of copper
- several tens of micron copper thickness by subsequent chemical copper plating
- selection of surface finishes, e.g. electro-less Nickel, immersion gold ("ENIG") available
- high aspect ratio plating from 1:1 for blind vias up to 1:10 for through mold vias/ through vias
More solutions for the semiconductor industry
Glass for Heterogeneous Integration -- a team of dedicated engineers and researchers allows you to take advantage of the latest process technology for thin glass applications while focusing on added value for your application.
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