AMP-Technology
Grounded Co-planar waveguide GCPW

Grounded co-planar waveguide (GCPW)

Active Mold Packaging
61 GHz Bow Tie Antenna with 50 OHM impedance matching

61 GHz Bow Tie Antenna with 50 OHM impedance matching

Active Mold Packaging
Face-Up Die Package-on-Package (PoP)

Face-up die package-on-package (PoP)

Active Mold Packaging
Pre-mold Leadframe for fine pitch, chip scale (CS) quad-flat no lead (QFN) packages

Pre-mold leadframe for fine pitch, chip scale (CS)
quad-flat no lead (QFN) packages

Active Mold Packaging
Counterfeit-Proof Marking of IC Packages and SiPs

Counterfeit-proof marking of IC packages and SiPs

Active Mold Packaging
Flip-Chip Package-on-Package (fc-PoP)

Flip-chip package-on-package (fc-PoP)

Active Mold Packaging

Why Active Mold Packaging (AMP)?

To functionalize the real-estate of the epoxy mold compound.

Active Mold Packaging is an easy, time-saving and reliable 2.5D packaging approach, which establishes electrical circuitry on the surface and in the volume of the Epoxy Mold Compound.

Epoxy mold compounds (EMC) for semiconductors can do more for you

Reduced package cost

Up to 30% cost reduction for Package-on-Package
compared to traditional sequential layer build up technology

Improved thermal management

Up to 10x higher heat dissipation of mold-embedded copper heat sink compared to thermally conductive Epoxy Mold Compounds

Reduced package footprint

Up to 50% more vias
compared to traditional TMV drilling and copper paste printing

Increased package lifetime

Capable of up to 50% more shear load, therefore greater solder joint reliability
compared to of traditional wire bonding.

Molding of Epoxy Mold Compounds

  • Epoxy Mold Compounds, modified for the Laser Direct Structuring (LDS) Technology

  • EMC available in liquid, granular and tablet form from a variety of compound suppliers

  • for Leadframe, Substrate and Wafer level applications

  • All standard and existing EMC compounds can be upgraded for use in Active Mold Packaging

Laser Direct Structuring with LPKF Laser Tools

  • Line/ Space of 25 um each
  • via aspect ratio of up to 1:10
  • laser patterning and via laser drilling in one process step
  • fully automed production
  • visual inspection station

Direct Copper plating

  • Laser Direct Structuring Technology enables direct electroless plating of copper
  • several tens of micron copper thickness by subsequent chemical copper plating
  • selection of surface finishes, e.g. electro-less Nickel, immersion gold ("ENIG") available
  • high aspect ratio plating from 1:1 for blind vias up to 1:10 for through mold vias/ through vias

More solutions for the semiconductor industry

Glass for Heterogeneous Integration -- a team of dedicated engineers and researchers allows you to take advantage of the latest process technology for thin glass applications while focusing on added value for your application.